Rudolph Technologies: MetaPULSE® Thin Film Metrology System

Multidisciplinary Industrial Design Challenge: Using an innovative industrial design approach, TKDG conceived of a modular design for the packaging of an instrument for analyzing film thickness and pattern compliance on silicon wafers. The design components had to comply with strict clean room requirements for class 10 wafer production. TKDG also provided engineering prototype design services for the sheet metal shelves and covers, produced final production drawings, and oversaw initial beta production.

Award Winner: Best Product Design, 2000, Semiconductor Industry Association